Welcome to Fraunhofer Group for Microelectronics

Fraunhofer Group for Microelectronics

Fraunhofer-Verbund Mikroelektronik

This year, the Fraunhofer Group for Microelectronics celebrates its twentieth anniversary. The 18 member institutes now form Europe’s leading R&D service provider for smart systems. Whether it is the energy turnaround, modern medical engineering, or Industry 4.0 – none of the future issues facing German industry can be dealt with without powerful microelectronics. Since 1996, the Fraunhofer Group for Microelectronics has bundled the expertise of its individual members – with the aim of providing German industry with optimum support in developing top products. 

The Fraunhofer Group for Microelectronics, founded in 1996, is a service provider for R&D in the areas of microelectronics and smart systems integration. As part of the Fraunhofer-Gesellschaft, Europe's largest organization for application-oriented research, it combines the expertise of 11 Fraunhofer institutes (plus seven guest institutes) with a total of more than 3,000 employees.

 

The activities of the 16 member institutes and research institutions are coordinated by the business office in Berlin. This central coordination office forms the portal between the institutes on the one hand and science, business, and government on the other.

 

The employees of the business office of the Fraunhofer Group for Microelectronics are also responsible for the development and monitoring of a common strategy as well as for the cross-institutional public relations. 

                                       Fraunhofer Group for Microelectronics - Mission

 

With a unique range of expertise not found elsewhere in the world, we bridge the gap between fundamental research and product development in the areas of

• microelectronics and nanoelectronics, including microsystem technologies and power

  electronics, as well as

• nanotechnologies, new materials, photonics, and advanced manufacturing technologies.

 

As the leading international research and development provider, we are working on solving social challenges such as aging society, urbanization, globalization, energy and resources, environment and climate, health, mobility, and living and working in the knowledge society.

 

We support our customers along the entire value chain: from the basic technologies to the end product.

 

We are contributing to shaping our future by bridging the gap between

• short-term, application-oriented and

• our longer-term strategic research

for small and medium-sized enterprises and large companies.

 

 

                                  Technology - Application - Society: Bridging the Gap

News

Sie sind unentbehrlich, wenn elektrische Energie verteilt, umgewandelt oder gespeichert werden soll: leistungselektronische Bauelemente. Besonders zuverlässig müssen diese Bauteile sein, wenn sie an zentralen oder schwer zugänglichen Punkten im Energienetz wie in Umspannwerken oder Offshore-Windanlagen zum Einsatz kommen. Gerade...

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Mr. Reiner, what are you working on at the moment?

Together with my colleagues, I am working on the development of gallium-nitridebased semiconductor devices such as transistors and diodes. Many power electronic systems in e-mobility, aerospace, or illumination can be made more efficient, more compact, lighter, and more...

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To minimize vehicle weight and fuel consumption while providing the highest level of crash safety, automotive bodies are reinforced with elements made from highstrength steel. Automotive manufacturers and suppliers are relying more and more on hot stamping or press-hardening processes to produce these components. Fraunhofer IZFP...

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Events

06. May - 06. May

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8th Fraunhofer IMS Workshop - CMOS Imaging - Seeing the future
09. May - 10. May

  The 8th CMOS Imaging Workshop of Fraunhofer IMS in Duisburg / Germany takes place on 9th and...