About the institute

The Fraunhofer Institute for Reliability and Microintegration IZM in Berlin develops methods and technologies for mounting and connecting microelectronic and microsystem components and systems (electronic packaging). This work is based on research demonstrating the behavior of materials in the microsphere (e.g. polymers and metals), and on the mechanical reliability of components. The findings provide input used to estimate the useful life of electronic assemblies. Work in the polymer field is devoted to advancing the development and characterization of materials.

main research fields:

• Reliabality Assessment and Research
• Technology Qualification and Test
• 3D Silicon Integration (Through Silicon, Thin Chip Integration, Chip to Chip)
• Wafer Level System Integration
• “System in Package”-Integration
• System Integration on Flexible Materials
• Power Electronic, LED Design and Packaging
• Photonic System Intergration
• MEMS and Sensor Packaging
• HF and Wireless Design and Packaging
• Green Electronics

Address

• Fraunhofer Institute for Reliability and Microintegration IZM

  Gustav-Meyer-Allee 25
  13355 Berlin
  Germany

  • georg.weigelt(at)izm.fraunhofer.de

  • www.izm.fraunhofer.de

  • Phone +49 30 46403 -100
  • Fax +49 30 46403 -111