Fraunhofer IZM / Symposium / 30. Januar 2019
Symposium Panel Level Packaging
Status update at SEMI’s 3D & Systems Summit
It is our great pleasure to invite you to the next Symposium on »Status & Trends in Panel Level Packaging« at Hilton Hotel in Dresden as post event of the 3D & Systems Summit.
Join the symposium to receive latest research results on this exciting new manufacturing technology enabling:
- Market and application trends
- Latest technology results for PLP
- Material, equipment and process developments for large area and fine line processing
- Cost analysis
Mehr Informationen finden Sie hier:
www.izm.fraunhofer.de/en/news_events/events/panel-level-packaging-symposium-dresden-2019.html