Fraunhofer IZM / Symposium  /  January 30, 2019

Symposium Panel Level Packaging

Status update at SEMI’s 3D & Systems Summit

It is our great pleasure to invite you to the next Symposium on »Status & Trends in Panel Level Packaging« at Hilton Hotel in Dresden as post event of the 3D & Systems Summit.

Join the symposium to receive latest research results on this exciting new manufacturing technology enabling:

  • Market and application trends
  • Latest technology results for PLP
  • Material, equipment and process developments for large area and fine line processing
  • Cost analysis

 

More information here:

www.izm.fraunhofer.de/en/news_events/events/panel-level-packaging-symposium-dresden-2019.html