In order to make microelectronics even more intelligent, manufacturers rely on integrating an increasing number of functions into chips of decreasing size. When it comes to these “More-than-Moore” technologies, no single site exists yet in Europe where customers can find everything necessary for the production of small series.

This is where the European project ADMONT – which also includes Fraunhofer IIS/ EAS as a member – comes in. The objective is, by 2019, to create pilot lines for these technologies in and around Dresden, making them available to companies from various industries for their product development work. According to the modular design principle, they should be able to use either individual modules or entire manufacturing chains.

Researchers at Fraunhofer IIS/EAS are responsible for guaranteeing the quality of the microchips that are produced. At the midpoint of the project, they have already developed the initial models for simulations that realistically represent the components’ future behavior. The work is intended to assist the integrated-circuit designers in coming up with systems that function robustly and reliably for long periods. After that, the models are to be refined further and supplemented with additional ones. This will allow the pilot lines to be used for customers with particularly individual requirements in the future.