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Fraunhofer IMS has developed a new RFID technology for the use in and on metal.

Together with partners from industry and research, Fraunhofer IISB is developing ways to limit the degradation of solar cells.

With the increasing processing of ever higher data rates, the quality of signal transmission must also improve. While optical signal transmission currently dominates for long transmission distances, a large part of signal transmission at circuit board level is still electrical.

New manufacturing technologies must be developed for the next generation of highly integrated microelectronics. To this end, the European “PIN3S” project is working on processes for the production of ICs with lead spacing of only 3 nm.

The Fraunhofer Institutes IISB and IPA are involved in the design and testing of an intelligent DC power supply system for production plants.

The continuing rapid development in the semiconductor industry also places special demands on the processes for structure transfer to silicon wafers – lithography.

Fraunhofer EMFT and the Universität der Bundeswehr in Munich are developing a virtual reality system (VR) with olfactory components for the training of emergency and rescue staff.

The Development Center X-ray Technology EZRT of the Fraunhofer IIS has developed a technology for the simultaneous recording of internal and external structures in dynamic processes.

In the “power4re” project (Reliable converters for renewable energy supply), researchers are working on increasing the reliability and robustness of converters for wind power and photovoltaic plants.

Fraunhofer IAF is involved in the optimization of 5th generation mobile communication (5G).